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Zestron

Cleaning Solutions

VIGON® EFM

Water-based cleaning agent for stencil underside wiping in printers

VIGON® EFM is a precision cleaning agent designed to remove flux residues from electronic assemblies in manual applications. This product can also be used in explosion-proof spray-in-air equipment. VIGON® EFM is a mixture of halogen-free organic solvents. It dries fast and residue-free. VIGON® EFM is non-corrosive and compatible with most polymers.

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  • Areas of application – PCBA Defluxing

  • Advantages compared to other cleaners

    • Especially suitable for the removal of resin-based flux residues.

    • This product dries very fast and residue-free.

    • Easy-to-use, for both manual and automatic cleaning in explosion-proof equipment.

    • Very suitable as a cleaning and rinsing agent.


Process Steps

Cleaning Process

Parts

1. Cleaning

2. Rinsing

2. Drying

Manual cleaning

PCBAs

VIGON® EFM

VIGON® EFM

Compressed air or open air evaporation

Spray-in-air (explosion-proof)

PCBAs

VIGON® EFM

VIGON® EFM

Compressed air or open air evaporation



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Technical Data*

Density

(g/ccm) at 20°C/68°F

0.72

Surface tension

(mN/m) at 25°C/77°F

18.6

Boiling point

°C/°F

78 - 120°C / 172 - 248°F

Flash point

°C/°F

-12°C / 10°F

pH value

10g/l H2O

Not applicable

Vapor pressure

(mbar) at 20°C/68°F

Approx. 77

Cleaning temperature

°C/°F

Ambient Temperature

Solubility in water

-

Insoluble

Application


concentration

Ready-to-use

Pure

HMIS Rating

Health-Flammability-Reactivity

1 - 4 - 0

Specifications and appearance are subject to change without notice for improvement.


Product Features & Cleaning Standards

Electronic assemblies cleaned with VIGON® EFM in a ZESTRON specified process meet the following industry standards:

  • IPC-A-610 Visual cleanliness

  • J-STD 001 Ionic and resin cleanliness and foreign object debris

  • IPC 5704 Cleanliness requirements for bare boards

IPC-Hdbk-65B Guidelines for cleaning of printed boards and assemblies

A cleaning process using VIGON® EFM can help to reduce particle contamination.


100% compliance with EU guidelines (RoHS 1, 2 & 3, WEEE)

Extensively tested and suitable for cleaning lead-free solder pastes

Product is free of any critical substances according to SIN & SVHC lists


Environmental, health & safety regulations

  • VIGON® EFM is biodegradable.

  • VIGON® EFM is a highly flammable cleaning agent.

  • VIGON® EFM is formulated free of any halogenated compounds.

  • Refer to the SDS for specific handling precautions and instructions.


Availability & Storage

  • VIGON® EFM is available as an easy-to-use aerosol can with detachable brush for the manual removal of flux residues.

  • It is also available as ready-to-use solution.

  • Store VIGON® EFM in the original container at a temperature between 5 - 30°C / 41 - 86°F.

  • The product has a minimum shelf life of 5 years in fact



  • Available as concentrate and ready-to-use solution.

  • Store VIGON® RC 101 in the original container at a temperature between 5 - 30°C / 41 - 86°F.

  • The product has a minimum shelf life of 5 years in factory sealed containers.


Further product information

  • Material Compatibility

    Please review the Material Compatibility overview before using the cleaning agent.

  • Safety Data Sheet


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