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Zestron

Cleaning Solutions

VIGON® RC101

Water-based cleaning medium for manual cleaning of reflow ovens and wave solder systems

Based on the MPC® Technology, VIGON® RC 101 was specifically developed to remove all types of baked-on flux residues from reflow and wave solder equipment. It reliably removes re-condensated fluxes and emissions from assemblies. VIGON® RC 303 is the successor product with increased cleaning performance.

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  • Areas of application

  • Advantages compared to other cleaners

    • VIGON® RC 101 has a mild formulation. Therefore, no special labeling is required

    • Excellent material compatibility with aluminum and epoxy surfaces

    • The cleaning agent is also suitable for the pre-cleaning of condensation traps.

    • VIGON® RC 101 has little odor.

    • VIGON® RC 101 has no flash point and therefore can be applied directly onto cold or warm surfaces (30 - 40 °C / 86 - 104 °F).

    • The medium does not contain any ingredients, which could leave residues on the oven surfaces; therefore, avoiding harmful condensations on the assembly surfaces after restarts.

    • Due to the short soaking time, a quick and efficient cleaning process can be achieved and long machine downtimes can be avoided

    • Reduced cleaning agent consumption compared to IPA.



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Technical Data*

Density

(g/ccm) at 20°C/68°F

0,99

Surface tension

(mN/m) at 25°C/77°F

29,4

Boiling point

°C/°F

>99 - 212°C / 210 - 414°F

Flash point

°C/°F

None

pH value

10g/l H2O

10.8

Vapor pressure

(mbar) at 20°C/68°F

Approx. 11

Cleaning temperature

°C/°F

20-50°C / 68-122°F

Solubility in water

-

Soluble

Application


concentration

Ready-to-use

Pure

HMIS Rating

Health-Flammability-Reactivity

0 - 0 - 0

Density

(g/ccm) at 20°C/68°F

0,99


Product Features & Cleaning Standards

100% compliance with EU guidelines (RoHS 1, 2 & 3, WEEE)

Extensively tested and suitable for cleaning lead-free solder pastes

Typical applications

  1. Manual cleaning of reflow ovens and wave solder equipment

1.Spray directly onto cold or warm surfaces (1l bottle)

2.Allow cleaning agent to stand for approximately 5 min.

3.Wipe surface clean with a cloth or paper towel

4.Air dry

2. Automated cleaning of conveyor fingers in wave solder equipment

1.Fill the cleaning reservoir of the wave solder equipment with VIGON® RC 101

2.Automatic brushing device in wave solder oven wipes conveyor fingers clean

3.Air dry

Environmental, health & safety regulations

  • VIGON® RC 101 is water-based and biodegradable.

  • VIGON® RC 101 is formulated free of any halogenated compounds and therefore environmentally friendly.

  • Refer to the SDS for specific handling precautions and instructions.

  • This product is a non-hazardous material and according to EU standard special labeling is not required.


Availability & Storage

  • Available as concentrate and ready-to-use solution.

  • Store VIGON® RC 101 in the original container at a temperature between 5 - 30°C / 41 - 86°F.

  • The product has a minimum shelf life of 5 years in factory sealed containers.


Further product information

  • Material Compatibility

    • Please review the Material Compatibility overview before using the cleaning agent.

  • MPC® Technology Sheet

    • Detailed information on MPC® Technology.

  • Safety Data Sheet


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