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Zestron

Cleaning Solutions

VIGON® UC160

Water-based cleaning agent for stencil underside wiping in printers

VIGON® UC 160 is a water-based cleaning agent specifically designed to remove solder paste from stencils in SMT printers. It has an excellent wetting ability on the fabric, which leads to an improved cleaning performance and thereby reduces smearing on the stencil underside significantly. This in turn prevents solder paste bridging on boards and ensures good and reliable printing results. VIGON® UC 160 is also an ideal replacement for Isopropanol due to excellent health and safety characteristics.

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  • Areas of application – Stencil & Misprint Cleaning

  • Advantages compared to other cleaners

    • VIGON® UC 160 effectively removes the latest lead-free & lead-based solder pastes from stencils in underside wiping, even out of fine pitch apertures.

    • The cleaner is specifically suitable for print after wait.

    • Provides excellent wetting ability on stencils and therefore increased cleaning performance, which significantly reduces smearing on the stencil underside. Thus, bridging of solder paste on the boards can be avoided.

    • Good delineation stability further ensures reduced solder balling.

    • High operational safety and ideal replacement for Isopropanol due to excellent health and safety characteristics, no flash point, low VOC level.

    • VIGON® UC 160 has low odor.

    • The product has been approved by leading international manufacturers for the use in their stencil printers. Written approvals can be obtained from ZESTRON.


Process Steps

Cleaning Process

1. Cleaning

2. Vacuum

3. Drying

SMT printer

VIGON® UC 160

Fabric

Fabric



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Technical Data*

Density

(g/ccm) at 20°C/68°F

1.00

Surface tension

(mN/m) at 25°C/77°F

43.1

Boiling range

°C/°F

100 – 190 / 212 – 374

Flash point

°C/°F

None until boiling

pH value

10g/l H2O

Neutral

Vapor pressure

(mbar) at 20°C/68°F

Approx. 21.0

Cleaning temperature

°C/°F

Room temperature

Application


concentration

Ready-to-use

Pure

HMIS Rating

Health-Flammability-Reactivity

0 - 0 - 0

* Specifications and appearance are subject to change without notice for improvement.



Product Features & Cleaning Standards

After cleaning the underside of SMT stencils used for production with VIGON® UC 160, PCBs meet the requirements of the following standard:

  • IPC-9202 Material and Process Characterization/Qualification


100% compliance with EU guidelines (RoHS 1, 2 & 3, WEEE)
Extensively tested and suitable for cleaning lead-free solder pastes

Product is free of any critical substances according to SIN & SVHC lists


Environmental, health & safety regulations

  • VIGON® UC 160 is water-based and biodegradable

  • The cleaning agent is formulated free of any halogenated compounds.

  • The product is a non-hazardous material and according to EU standards does not require specific labeling.

  • Refer to the SDS for specific handling precautions and instructions.


Availability & Storage

  • Available as ready-to-use solution.

  • Store VIGON® UC 160 in the original container at a temperature between
5 - 30°C / 41 - 86°F.

  • The product has a minimum shelf life of 5 years in factory sealed containers.


Further product information

  • Material Compatibility

    Please review the Material Compatibility overview before using the cleaning agent.

  • Evaluation guideline

    Guideline for stencil underside wiping in SMT printers.

  • Process reliability

    Additional information about underside wiping in printers.

  • Safety Data Sheet



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